ITO Target
Our company's unique slurry formation technology (flat plate - MMF method ) (cylindrical - CIP method) allows us to achieve high density in a variety of shapes and sizes.
We assure to reduce nodules and particles during use.
We also provide customized products to meet customer needs for touch panel applications where heat treatment after film formation is not possible.
Applications
- Flat Panel Displays
- Touch panel applications
Characteristic Value
| standard | unit | remarks | ||
|---|---|---|---|---|
| composition | In2O3 | balance | wt.% | - |
| SnO2 | 3,5,7,10 ※1 | - | ||
| purity | ITO | ≧99.99 | % | - |
| Relative density *2 | ≥98 | % | - | |
| 7.12 | g/cm3 | - | ||
*1 Standard composition. Other compositions are also available upon request.
*2 10wt% SnO2-ITO
Manufacturing process
Ultra-high density sputtering target made from MMF™ sintered body using our unique manufacturing process
This is our own new manufacturing method (slurry molding technology).
Characteristic
- Reduction of nodules
- Reduction of particles and metal foreign matter
- Reduction of abnormal discharge (arcing)
Production Base
Japan: 2081 Tofune, Omuta City, Fukuoka Prefecture (Miike target Plant)
Taiwan: No. 6, Wei 5th Rd., Wuqi Dist., Taichung City (Mitsui Electronic Materials Co.,Ltd.)
Other product
